Dicyandiamide (DICY) Latent Epoxy Curing Agent

DICY is insoluble in epoxy resin at room temperature (limited miscibility below 100°C), providing unlimited shelf life in premixed systems — a critical requirement for prepreg and film adhesive applications stored for months before use. At stoving temperature (150–180°C), DICY dissolves in the molten epoxy and reacts rapidly, producing highly crosslinked networks with excellent electrical properties, hot/wet retention, and adhesion to metals. Particle size control (<10 µm micronised) is critical to ensure homogeneous dissolution and avoid unreacted DICY particles causing local property defects.