Laminating Adhesives Chemicals
Laminating adhesive raw materials include solventless polyurethane systems, solvent-based PU adhesives, waterborne adhesives, polyol and isocyanate components, and tie-layer resins for flexible packaging laminates, food-grade multilayer films, and industrial specialty laminations requiring bond strength, barrier performance, and FDA compliance.
1,4-Butanediol Chain Extender for PU Adhesives
CAS 110-63-4
MOQ: 50 kg
Acrylic Hot-Melt PSA AHMPSA-40
MOQ: 200 kg
Acrylic-Modified Epoxy Adhesive AME-50
MOQ: 25 kg
Adhesive Defoamer DAP-15
MOQ: 25 kg
Alpha-Pinene Terpene Resin Tackifier APT-90
MOQ: 25 kg
C5/C9 Copolymer Resin Tackifier C59-100
MOQ: 100 kg
Castor Oil Renewable Polyol for Eco PU Adhesives
CAS 8001-79-4
MOQ: 200 kg
Chlorinated Polypropylene Resin EG40M (28–35% Cl, Dry Lamination)
CAS 68442-33-1
MOQ: 25 kg
Hydrogenated C9 Aromatic Tackifier HC9-120
MOQ: 200 kg
Hydrogenated Rosin Methyl Ester HRME-80
MOQ: 100 kg
IPDI Monomer for PU Adhesives
CAS 4098-71-9
MOQ: 200 kg
MUF Adhesive Resin for Exterior-Grade Wood
MOQ: 200 kg
Maleic Anhydride Grafted Adhesion Promoter MA-Graft
MOQ: 50 kg
Natural Starch Dextrin Adhesive NSD-70
CAS 9004-53-9
MOQ: 200 kg
Neoprene-Based Hot-Melt Adhesive NHA-50
MOQ: 50 kg
PU Foam Adhesive for Rigid Insulation Panel PFA-10
MOQ: 100 kg
PU Laminating Adhesive 1K Solventborne PLA-25
MOQ: 50 kg
Phenol-Resorcinol-Formaldehyde Adhesive PRF-55
MOQ: 100 kg
Phenolic Resole for Structural Laminate Adhesive PRL-60
CAS 9003-35-4
MOQ: 200 kg
Polyamide Hot-Melt Adhesive Granules PA-190
MOQ: 25 kg
Polyimide Film Adhesive for High-Temp Bonding PI-500
MOQ: 5 kg
Polyvinyl Acetate Emulsion Wood Adhesive PVAc-50
CAS 9003-20-7
MOQ: 200 kg
Polyvinyl Butyral Adhesive Resin PVB-3000
CAS 63148-65-2
MOQ: 25 kg
SBS Block Copolymer for Hot-Melt and Contact Adhesives
CAS 9003-55-8
MOQ: 200 kg
Frequently Asked Questions — Laminating Adhesives Chemicals
What are the main laminating adhesive technologies for flexible packaging?
Solventless two-component polyurethane (2K PU) adhesives dominate flexible packaging for their low VOC, fast line speed (up to 600 m/min), and excellent bond strength on OPP, PET, BOPA, and PE films. Solvent-based PU adhesives are used for demanding applications (retort pouches, high-barrier films). Waterborne adhesives serve lower-performance commodity laminates. Electron-beam (EB) curable adhesives are emerging for ultra-low migration applications.
How is primary adhesion achieved between dissimilar films?
Adhesion to low-surface-energy films (PE, PP) requires corona treatment (≥42 dyne/cm) immediately before lamination. Primer coatings (polyethyleneimine, polyurethane) improve adhesion on difficult substrates and barrier coatings (EVOH, SiOx, AlOx). Silane coupling agents in the adhesive formulation promote bonding to aluminum foil and metallized films. Bond strength is measured by T-peel (ASTM F904) and 90° peel tests.
What are migration requirements for food-contact laminating adhesives?
EU Regulation 10/2011 (plastic food contact materials) requires overall migration ≤10 mg/dm² and specific migration limits for individual substances. US FDA 21 CFR 175.105 regulates adhesives for food contact. Solventless PU adhesives must demonstrate low aromatic diamine (PAA) migration — controlled by using non-aromatic isocyanates (HDI, IPDI) and ensuring full cure. Suppliers provide compositional declarations and SML data for regulatory compliance.
How is pot life managed in solventless 2K PU laminating adhesives?
Pot life of solventless 2K PU adhesives is typically 4–8 hours at 40°C working temperature, determined by isocyanate index and reactive component selection. Viscosity build during pot life is monitored — adhesive viscosity should remain below 1000 mPas at application temperature for consistent coat weight. Longer pot life requires lower reactivity isocyanate or MDI/HMDI blends. Temperature control of the adhesive pan is essential for process consistency.
What bond strength is required for retort pouch laminate structures?
Retort pouches (121°C steam sterilization) require bond strength ≥3.5 N/15mm after retorting for all laminate interfaces (PET/Al, Al/CPP). Adhesives must maintain performance after extended hot-fill or sterilization cycles with no delamination, tunneling, or bond failure. High-functionality polyol components and aliphatic isocyanates (HDI) give the best thermal stability. Bond strength is tested after retort per ASTM F88.
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