Name: Polyimide Film Adhesive for High-Temp Bonding PI-500
Brand: Coatingsink
SKU: polyimide-high-temp-adhesive
Availability: PreOrder

Question 1

Why does PI-500 require a two-stage cure cycle rather than a single elevated-temperature step?

Accepted Answer

The two-stage cycle controls the imidization reaction kinetics. The first stage at 200°C removes residual solvent and promotes partial ring closure without generating voids from rapid water evolution; the second stage at 250°C drives complete cyclization to achieve Tg >350°C and full cohesive strength. Collapsing both stages into one typically results in porosity and a 20–30% loss in lap shear performance.

Question 2

Which substrate combinations is PI-500 qualified for?

Accepted Answer

PI-500 bonds titanium, Inconel 625, aluminum, stainless steel 316L, alumina (Al₂O₃) ceramics, and PEEK composites. For bare ceramic substrates, a sputtered titanium bond coat (0.1–0.2 μm) is recommended to provide a reactive metallic interface for the polyimide backbone, improving adhesion by anchoring amic acid intermediates during imidization.

Question 3

How does lap shear strength degrade at temperatures above 250°C for joint design purposes?

Accepted Answer

PI-500 retains approximately 12 MPa at 280°C and 8 MPa under short-term loading at 300°C. For continuous structural loads at the rated 300°C ceiling, design with a safety factor ≥2 and supplement with mechanical fasteners in any peel- or cleavage-critical configuration to guard against creep under sustained stress.

Cure Cycle	200°C / 2 h + 250°C / 1 h at 30 bar
Film Thickness	50 μm
Lap Shear Strength (250°C)	15 MPa
Continuous Service Temperature	300°C
Glass Transition Temperature (Tg)	>350°C

Polyimide Film Adhesive for High-Temp Bonding PI-500

Specifications

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