Name: Polyamide Hot-Melt Adhesive Granules PA-190
Brand: Coatingsink
SKU: hotmelt-polyamide-adhesive-granules
Availability: InStock

Question 1

What processing temperature and equipment are recommended for PA-190?

Accepted Answer

PA-190 is processed at 200–220°C using hot-melt dispensing equipment (slot-die, bead-gun, or injection mould). At 210°C the melt viscosity of 8,000–12,000 mPa·s is compatible with standard gear-pump dispensers for over-moulding onto metal, rubber, and woven substrates.

Question 2

How does PA-190 compare with EVA and moisture-cure PUR hot-melts for underhood wire harness applications?

Accepted Answer

Unlike EVA, PA-190's amide backbone provides excellent resistance to engine oils, greases, and automotive fluids (ASTM D471), preventing bond creep at underhood temperatures. Unlike PUR, it requires no humidity conditioning and can be re-melted for field rework, a key advantage for harness over-moulding serviceability.

Question 3

What peel strength can be expected when bonding EVA foam insoles to non-woven textile uppers?

Accepted Answer

PA-190 achieves ≥3 N/mm (180° peel, 25 mm strip) on EVA/non-woven assemblies after cooling to 23°C. Its ambient-temperature flexibility (Shore D ≈ 35) prevents cohesive failure under repeated footwear flex cycles, meeting SATRA TM92 durability criteria.

Acid Value	≤4 mg KOH/g
Amine Value	≤3 mg KOH/g
Softening Point (Ring & Ball)	190 ± 5°C
Open Time (210°C application)	30–60 s
Melt Viscosity (210°C, Brookfield)	8,000–12,000 mPa·s

Polyamide Hot-Melt Adhesive Granules PA-190

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