Phenolic Resole for Structural Laminate Adhesive PRL-60

CAS 9003-35-4

In Stock

MOQ

200 kg

Lead Time

7–14 days

Packaging

200 kg drums / 1000 kg IBC

Specifications

pH (25°C)9.5–11.0
Free Phenol<0.8%
Solids Content60 ± 1%
Gel Time (140°C)60–90 s
Viscosity (25°C)800–1500 mPa·s

FAQ

A press temperature of 140–180°C at 0.8–1.2 MPa specific pressure for 5–8 minutes per 10 mm board thickness achieves full cure. Higher temperatures reduce press time but require careful monitoring to prevent pre-curing during glue-line assembly.

Interested in Phenolic Resole for Structural Laminate Adhesive PRL-60?

Get a quote, request a sample, or ask a technical question.