Name: Underfill Epoxy Adhesive for Flip-Chip UE-100
Brand: Coatingsink
SKU: underfill-epoxy-electronics
Availability: PreOrder

Question 1

What capillary flow rate and fillet height can I expect with UE-100 under a 200 μm standoff BGA?

Accepted Answer

At 70°C substrate pre-heat, UE-100 achieves complete fill under a 200 μm standoff for a 10×10 mm die in approximately 10–15 seconds with a 0.5 mm fillet height. Increasing pre-heat to 80°C reduces flow time by ~20% without advancing cure, improving throughput on high-volume lines.

Question 2

How does UE-100's CTE of 28 ppm/°C affect solder joint reliability in thermal cycling?

Accepted Answer

FR-4 has a CTE of ~16 ppm/°C and silicon ~3 ppm/°C. UE-100's intermediate 28 ppm/°C reduces strain concentration at solder joints during thermal cycling. In JEDEC TCB (−40 to +125°C) testing, properly underfilled assemblies typically demonstrate 3–5× longer solder joint fatigue life compared to bare, unfilled boards.

Question 3

Does UE-100 meet IPC-SM-817C requirements, and what qualification documentation is available?

Accepted Answer

Yes. UE-100 complies with IPC-SM-817C for moisture sensitivity level (MSL), UL 94 V-0 flammability, and adhesion retention after 85°C/85% RH conditioning for 1,000 hours. Full qualification packages including DSC, TMA, DMA data, and cross-section micrographs are available upon request.

Cure Schedule	150°C / 60 min
CTE (below Tg)	28 ppm/°C
Filler Content	~65 wt%
Viscosity (25°C)	1,000 mPa·s
Glass Transition Temperature (Tg)	135°C

Underfill Epoxy Adhesive for Flip-Chip UE-100

Specifications

FAQ

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