Name: Thermally Conductive Adhesive Base TCA-30
Brand: Coatingsink
SKU: thermally-conductive-adhesive-base
Availability: InStock

Question 1

What filler gives TCA-30 its thermal conductivity while maintaining electrical insulation?

Accepted Answer

TCA-30 uses a high loading of hexagonal boron nitride (h-BN) platelets, achieving 3.0 W/m·K thermal conductivity while maintaining volume resistivity >1×10¹⁴ Ω·cm. Unlike silver-filled systems, h-BN is fully electrically insulating — critical for direct die-attach or LED substrate bonding where leakage currents must be zero.

Question 2

How thin a bond line can TCA-30 achieve, and what surface preparation is recommended?

Accepted Answer

Under bonding pressures of 0.2–0.5 MPa with controlled fixturing, TCA-30 achieves bond lines below 100 µm. Surfaces should be degreased with isopropyl alcohol and, ideally, plasma-treated or primed with an aminosilane coupling agent to maximise adhesion to aluminium heatsinks, alumina ceramics, and FR-4 substrates.

Question 3

What cure schedules are compatible with PCB assembly processes?

Accepted Answer

TCA-30 supports flexible cure: 80°C for 60 minutes for temperature-sensitive assemblies, or 150°C for 15 minutes for higher-throughput lines. A snap cure at 180°C in 5 minutes is achievable but reduces pot life to under 30 minutes. Full mechanical properties develop within 24 hours post-cure at room temperature.

Cure Condition	80°C/60 min or 150°C/15 min
Viscosity (25°C)	45,000–65,000 mPa·s
Volume Resistivity	>1×10¹⁴ Ω·cm
Bond Line Thickness	<100 µm
Thermal Conductivity	3.0 W/m·K

Thermally Conductive Adhesive Base TCA-30

Specifications

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