Thermally Conductive Epoxy Adhesive TCE-3W
In StockMOQ
10 kg
Lead Time
10–18 days
Packaging
1 kg cartridges, 10 kg pails
Specifications
| Filler | Al2O3 + BN hybrid |
| Cure Temp | 80°C / 1 h or RT / 24 h |
| Lap Shear | >10 MPa |
| Viscosity (25°C) | 50000–100000 mPa·s |
| Thermal Conductivity | 3.0 W/m·K |
FAQ
TCE-3W uses a hybrid filler of aluminum oxide (Al2O3) for baseline conductivity and boron nitride (BN) platelets for their exceptional directional thermal conductivity (300 W/m·K in-plane), delivering 3.0 W/m·K in the bulk adhesive with minimal electrical conductivity.
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