Polysulfide-Modified Epoxy Curing Agent LP-3

LP-3 introduces –S–S– (disulfide) and –C–S– (thioether) linkages into the cured network, which act as flexible chain segments reducing the modulus of the cured film from ~3 GPa (rigid epoxy) to 50–200 MPa. This dramatically improves crack bridging (elongation 80–150%) and thermal cycling resistance (–50°C to +90°C). Primary applications include: aircraft integral fuel tank sealants, ship ballast tank linings requiring movement accommodation, expansion joint coatings on bridges, and potting compounds for underwater connectors. The sulfide groups also confer inherent biocidal activity, reducing biofouling in marine immersion service.