Name: Silver-Filled Conductive Epoxy Adhesive CES-80
Brand: Coatingsink
SKU: conductive-epoxy-silver-adhesive
Availability: PreOrder

Question 1

What is the cure schedule for CES-80 and can it be cured at lower temperatures?

Accepted Answer

CES-80 is optimized for 150°C/30 min. Full electrical and mechanical properties require this cycle; partial cure at 130°C is possible but volume resistivity will be measurably higher. Snap cure at 175°C/15 min is also supported for high-throughput SMT lines.

Question 2

Is CES-80 suitable for RF EMI shielding gaskets, and what is its shelf life?

Accepted Answer

Yes. The silver flake network provides effective shielding up to several GHz, making CES-80 suitable for RF can lids, connector seals, and shielding gaskets. Shelf life is 6 months at −20°C; once thawed to room temperature, use within 24 hours to avoid viscosity drift.

Question 3

How does the 80 wt% silver loading balance conductivity and adhesion strength?

Accepted Answer

At 80 wt% Ag, CES-80 operates near the percolation plateau where further silver increases yield diminishing conductivity gains. This loading achieves volume resistivity <5×10⁻⁴ Ω·cm while maintaining ≥30 MPa shear strength on copper, alumina, and Kovar substrates — a balance that higher loadings sacrifice by reducing binder content.

Cure Schedule	150°C / 30 min
Silver Content	80 wt%
Viscosity (25°C)	60,000–90,000 mPa·s
Volume Resistivity	<0.0005 Ω·cm
Lap Shear Strength (Al/Al)	≥30 MPa

Silver-Filled Conductive Epoxy Adhesive CES-80

Specifications

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