Name: Thermally Conductive Silicone Sealant Base TCS-20
Brand: Coatingsink
SKU: thermally-conductive-silicone-sealant
Availability: InStock

Question 1

How does TCS-20 achieve 2.0 W/m·K thermal conductivity while remaining electrically insulating?

Accepted Answer

TCS-20 uses a bimodal filler system of hexagonal boron nitride (hBN) platelets and spherical alumina (Al₂O₃). hBN contributes high in-plane thermal conductivity and is intrinsically electrically insulating, while alumina fills interstitial voids to maximise phonon pathway density. The resulting composite maintains dielectric strength ≥15 kV/mm, which is critical for EV battery and power module applications.

Question 2

What cure chemistry does TCS-20 use and what substrates should be avoided?

Accepted Answer

TCS-20 is an addition-cure (platinum-catalysed) RTV-2 silicone system that cures via hydrosilylation. It cures at room temperature in 24–48 hours or can be accelerated at 80–100°C for 30–60 minutes with no condensation by-products. Formulators must avoid contact with tin compounds, sulfur, phosphorus, or amine-containing substrates, which poison the platinum catalyst and inhibit cure.

Question 3

Is TCS-20 appropriate for cell-to-cooler gap filling in lithium-ion battery packs?

Accepted Answer

Yes. The combination of 2.0 W/m·K conductivity, ≥15 kV/mm dielectric strength, and a -60 to +200°C operating range meets the primary requirements for EV battery module thermal interface materials. The low Shore A hardness of 35–45 is particularly important: it allows the cured sealant to absorb thermal expansion cycling without imposing mechanical stress on cell surfaces or module housings.

Volume Resistivity	≥1×10¹⁴ Ω·cm
Dielectric Strength	≥15 kV/mm
Operating Temperature	-60 to +200°C
Shore A Hardness (cured)	35–45
Thermal Conductivity (ASTM E1461)	2.0 W/m·K

Thermally Conductive Silicone Sealant Base TCS-20

Specifications

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