Name: Photocure Silicone Potting & Sealant PSP-100
Brand: Coatingsink
SKU: photocure-silicone-potting-sealant
Availability: InStock

Question 1

How does PSP-100 cure in shadow areas blocked by opaque components?

Accepted Answer

UV exposure initiates rapid cure in light-exposed regions within seconds at ≥2,000 mJ/cm² (365 nm). Shadowed zones beneath opaque components cure via ambient moisture at room temperature over 12–24 hours, enabling complete encapsulation of complex PCB assemblies without elevated-temperature post-cure.

Question 2

What UV dose and lamp type are required for exposed-area cure of PSP-100?

Accepted Answer

A minimum dose of 2,000 mJ/cm² at 365 nm through a 3 mm layer is recommended. Medium-pressure mercury lamps and 365/385 nm LEDs are both suitable. Increasing the dose beyond 4,000 mJ/cm² reduces tack time but does not improve final Shore A hardness or adhesion.

Question 3

Is PSP-100 compatible with FR-4 PCBs, copper traces, and polycarbonate housings?

Accepted Answer

Yes. PSP-100 is formulated with low ionic contamination (Cl⁻ < 10 ppm, Na⁺ < 5 ppm) and releases no acetic acid during cure, protecting copper from corrosion. It is safe on polycarbonate and ABS housings; verify adhesion to specific conformal coatings with a 24-hour peel test before production use.

Cure Mechanism	UV + moisture dual-cure
Viscosity (25°C)	2,000 mPa·s
Service Temperature Range	-55 to +200°C
Shore A Hardness (fully cured)	30
Light Transmittance (3 mm layer)	≥92%

Photocure Silicone Potting & Sealant PSP-100

Specifications

FAQ

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